Destructive analysis | Package opening (decapping)
Are you having trouble with decapping (resin opening, package opening), which is essential for failure analysis of ICs and semiconductors?
We offer package opening for ICs using copper (Cu) wires, silver (Ag) wires, and more, utilizing our uniquely developed method to minimize wire dissolution and damage. We also accept package opening for resin-sealed power modules, such as high-voltage and high-current components like IGBTs, which are difficult to open due to the high content of fillers.
- Company：ユーロフィンFQL
- Price：Other
